S/V300 MRAM Wafer Mapping System

Product Highlights:

• Automatic non-destructive,non-contact measurement of magnetic properties
• Measurement of MRAM, MR, GMR,TMR and permanent magnet wafers
• Active Field Control 0.001 Oe
• Zero Remanent Field
• High Field Up to 1.2 Tesla
• Ultra Small Laser Spot
• Patented Vector Kerr Mapping
• Fully Automated Cassette Handling
• Automatic Parameter Extraction

The S/V300 Wafer Mapping System rapidly and automatically creates a map of the magnetic properties of entire wafers or coupons made in conjunction with head wafers used to fabricate advanced heads or MRAM wafers. This permits rapid process feedback early to avoid adding expense to wafers, or portions of wafers, that may have poor yields. It also provides rapid feedback to the fabrication process, allowing users to make adjustments to the process to improve overall yield.

Description

The S/V300 Wafer Mapping System is available both as a low-cost manual-loading tool for use in development or limited-production environments and also as a fully-automated tool for use in volume production. Its unique ability to measure at both high fields and low fields, while providing very fine resolution, makes it a powerful diagnostic tool. In addition, proprietary extraction software automatically extracts key parameters from the raw data, thus eliminating manual interpretation of the results by operators and test technicians. This feature provides an added degree of consistency to process results and relieves highly-skilled personnel from a time-consuming repetitive chore.

Wafer Handling Robot with pre-aligner (Automation Upgrade)

This combined hardware/software option makes the tool fully automated for use in volume production. Using an integrated industry-standard robot and pre-aligner, wafers up to 300mm in size (round) and 210x210mm (square) may be measured without having to manually handle wafers in a cassette. The automation feature is compatible with all other optional features.

Skew Measurement Capability

The skew measurement option permits a user to perform a fully automated mapping measurement of the angular dependence of any parameter measured by the system. This combined hardware/ software option incorporates a high-precision integrated Z/Theta stage and associated parts, as well as new measurement capability integrated into the operating software. Because of the seamless software integration, enabling this feature requires no additional operator training.

Vector Kerr Measurements

Using patented Vector Kerr technology, the system is capable of measuring both components of the Kerr rotation. Thus, it is possible to perform true nondestructive mapping measurements of vector magnetic properties, such as the anisotropy field. It is also possible to measure both components of the Kerr rotation in the presence of a rotating field.

Camera-Based Vision System

By utilizing a joystick-based user-friendly software interface and high resolution camera and optics, it is possible to visualize the exact location of the wafer to be measured. The vision system is designed to work in conjunction with small and ultra small laser spot sizes. The pixel size of the wafer location image is less than 2 microns. This combined hardware/software option greatly simplifies an operator’s interactive motion on the wafer.