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S150/200 Wafer Mapping System

  • S150/200 Wafer Mapping System

Product Highlights:

  • Automatic non-contact measurement of magnetic properties

  • Measurement of MR, GMR, spin valve and permanent magnet wafers

  • Fast automatic mapping to provide rapid process feedback

  • High field (12,000 Oe), high sensitivity (0.01 Oe) measurement

Description

The S150/200 Wafer Mapping System is able to rapidly and automatically create a map of the magnetic properties of entire wafers or coupons made in conjunction with head wafers used to fabricate advanced heads. This permits rapid process feedback early to avoid adding expense to wafers, or portions of wafers, that may have poor yields. It also provides rapid feedback to the fabrication process, allowing users to make adjustments to the process to improve overall yield.

The S150/200 Wafer Mapping System is available both as a low-cost manual-loading tool for use in development or limited-production environments and also as a fully-automated tool for use in volume production. Its unique ability to measure at both high fields and low fields, while providing very fine resolution, makes it a powerful diagnostic tool. In addition, proprietary extraction software automatically extracts key parameters from the raw data, thus eliminating manual interpretation of the results by operators and test technicians.

Features

  • Within 10 seconds, the system measures a full hysteresis loop with up to 16,000 measurement points, including graphing, mathematical operations and save to disk.
  • A map of up to 1,024 wafer locations are programmable and can be saved as individual setup files.
  • The system automatically positions the wafer to the measurement location.
  • Each measurement can be automatically saved in ASCII-readable format and sent to a network drive or Statistical Process Control tool.
  • Automatic parameter extraction of:
    - Shift of free layer loop
    - Coercivity of free layer
    - Shift of pinning layer loop
    - Coercivity of pinning layer
    - Other parameters
  • Programmable field sweep rate, maximum field and data-array size.
  • Hardcopy printout of both graphs and data values may be printed on any Windows compatible printer (may also be networked).

Optional Modular Add-ons

  • Wafer Handling Robot. Makes the tool fully automated for use in volume production.
  • Four-point MR (Magneto-Resistance) probe. Measures MR at programmable locations.
    Skew measurement capability. 

Applications for this product

Easy Access Dispersion

Head Wafer Testing

Magnetic Characterization

Magnetic Head Testing

Magneto-Optic Measurements

Sputtering / Process Control

 

Related products

Model 10 VSM

EV Series VSMs

M2 Disk Mapper

X9 Magnetic Properties Mapping System

Polar Kerr System

SV300 MRAM Wafer Mapping System

Magneto Resistance Option

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